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Application Type 🢂 Semiconductors

Semiconductor applications include both front end and back end productions. These applications typically involve thin film metallizations on silicon wafers. These metallized wafer are eventually etched into nano-circuit lines which serve as interconnects for the many integrated circuits which are produced after the wafer is diced into small chips. Other metallizations include bonding pads and bumps. The list of standards below represents typical coatings that are measured on silicon wafers:

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