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Application Type 🢂 Lead Frames

Lead frames are thin metal strips commonly composed of copper or copper alloys such as CA194, and occasionally Fe-Ni alloys like Kovar, which are typically plated with Ag or some combination of Au, Au-Ag alloy, Pd & Ni. These strips are stamped or etched in repeating patterns so that they may be cut and formed into individual frames used to connect silicon based integrated circuits to printed circuit boards, facilitating communication with other components on the PCB. The semiconductor chips are bonded to the lead frame which may then be encapsulated and the entire assembly soldered onto a PCB. Plated layers are applied primarily to assure corrosion resistance and solderability. The lists below represent typical standards used for lead frame applications. Complete lists for these and all other applications may be found on the Product lists on this site.